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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18848128
Filing Dt:
09/18/2024
Publication #:
Pub Dt:
07/03/2025
Inventors:
Kazuhiro NISHIKAWA, Yuta HORI, Kengo INOUE
Title:
HEAT DISSIPATION MEMBER, COOLING DEVICE, AND SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
068616/0872Recorded: 09/18/2024Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/12/2024
Exec Dt:
06/12/2024
Exec Dt:
06/12/2024
Assignee:
338 KUZETONOSHIRO-CHO, MINAMI-KU
KYOTO, JAPAN 601-8205
Correspondent:
BENJAMIN J. HAUPTMAN
2318 MILL ROAD, SUITE 1400
ALEXANDRIA, VA 22314

Search Results as of: 09/23/2025 08:37 PM
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