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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18397962
Filing Dt:
12/27/2023
Publication #:
Pub Dt:
07/03/2025
Inventors:
Zhixin Xie, Andrew Matthew Jimenez, Liang He, Jung Kyu Han, Gang Duan
Title:
ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF A PACKAGE SUBSTRATE
Assignment: 1
Reel/Frame:
066709/0333Recorded: 03/09/2024Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/21/2023
Exec Dt:
12/20/2023
Exec Dt:
03/04/2024
Exec Dt:
12/21/2023
Exec Dt:
12/20/2023
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
ALLIANCE IP LLC
20 E. THOMAS ROAD, SUITE 2200
PHOENIX, AZ 85012

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