Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18588977
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Filing Dt:
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02/27/2024
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Publication #:
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Pub Dt:
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07/17/2025
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Inventors:
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Shih-Chieh Lin, Min-Shun Lo, Sheng-Yao Wu, Heng-Chi Huang, Yong-Zhong Hu
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14F., NO. 8, TAIYUAN 1ST ST. |
| ZHUBEI CITY, HSINCHU, TAIWAN |
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| RANDY W TUNG |
| 445 LONE PINE ROAD |
| BLOOMFIELD HILLS, MI 48304 |
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10/03/2025 06:47 AM
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