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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18868189
Filing Dt:
11/22/2024
Publication #:
Pub Dt:
09/04/2025
Inventors:
Bongkyun KANG, Andreas KLIPP, Minhyung CHO, Jinhye BAE, Jung-Min OH, Geonja LIM et al
Title:
ETCHING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
069601/0472Recorded: 12/16/2024Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/11/2024
Exec Dt:
10/14/2024
Exec Dt:
10/04/2024
Exec Dt:
10/04/2024
Exec Dt:
10/04/2024
Exec Dt:
10/15/2024
Exec Dt:
10/14/2024
Exec Dt:
10/14/2024
Assignees:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
CARL-BOSCH-STR. 38
LUDWIGSHAFEN AM RHEIN, GERMANY 67056
Correspondent:
MS. KIM ELLIS
P.O. BOX 1213
GREAT FALLS, VA 22066

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