Patent Assignment Details
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| Reel/Frame: | 004093/0530 | |
| Pages: | 1 |
| | Recorded: | 09/24/1982 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/18/1984
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Application #:
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06423283
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Filing Dt:
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09/24/1982
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Title:
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BONDING WIRE, SEMICONDUCTOR DEVICE HAVING THE SAME, AND BONDING METHOD USING THE SAME
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU, |
| KAWASAKI-SHI,, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT &
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DUNNER
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1775 K ST., N. W.
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WASHINGTON, DC 20006
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