Patent Assignment Details
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| Reel/Frame: | 004733/0369 | |
| Pages: | 1 |
| | Recorded: | 06/22/1987 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/07/1988
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Application #:
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07032976
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Filing Dt:
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03/26/1987
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Title:
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COPPER BASE LEAD MATERIAL FOR LEADS OF SEMICONDUCTOR DEVICES
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & WOODWARD
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261 MADISON AVENUE
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NEW YORK, NY 10016
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