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Patent Assignment Details
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Reel/Frame:004916/0336   Pages: 2
Recorded: 08/02/1988
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
04/17/1990
Application #:
07227253
Filing Dt:
08/02/1988
Title:
METHOD FOR ELECTRICALLY CONNECTING IC CHIPS, A RESINOUS BUMP-FORMING COMPOSITION USED THEREIN AND A LIQUID-CRYSTAL DISPLAY UNIT ELECTRICALLY CONNECTED THEREBY
Assignors
1
Exec Dt:
07/01/1988
2
Exec Dt:
07/01/1988
3
Exec Dt:
07/01/1988
4
Exec Dt:
07/01/1988
Assignees
1
2
Correspondence name and address
WENDEROTH, LIND, PONACK
SOUTHERN BLDG. - SUITE 700
805 FIFTEENTH ST. N.W.
WASHINGTON, DC 20005

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