Patent Assignment Details
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Reel/Frame: | 005726/0637 | |
| Pages: | 2 |
| | Recorded: | 05/28/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/1994
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Application #:
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07706053
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Filing Dt:
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05/28/1991
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Title:
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COPPER FOIL FOR INNER LAYER CIRCUIT OF MULTI-LAYERED PRINTED CIRCUIT BOARD, METHOD OF PRODUCING THE SAME AND MULTI-LAYERED PRINTED CIRCUIT BOARD HAVING THE SAME
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Assignees
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2-2, 1-CHOME, UCHISAIWAI-CHO, CHIYODA-KU, |
TOKYO, JAPAN |
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NF-KANDA BLDG., 1-8-9, KANDA-NISHIKI-CHO, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN AND WOODWARD
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600 THIRD AVENUE
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3OTH FLOOR
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NEW YORK, NY 10016
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