Patent Assignment Details
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| Reel/Frame: | 005849/0446 | |
| Pages: | 2 |
| | Recorded: | 09/06/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/1993
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Application #:
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07754754
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Filing Dt:
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09/04/1991
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Title:
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METHOD OF PRODUCING A BONDED WAFER
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Assignee
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| 4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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Correspondence name and address
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TOWNSEND & SNIDER
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SUITE 500
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1225 EYE STREET, N. W.
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WASHINGTON, DC 20007
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