Patent Assignment Details
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| Reel/Frame: | 005987/0470 | |
| Pages: | 11 |
| | Recorded: | 01/15/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/04/1993
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Application #:
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07822330
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Filing Dt:
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01/15/1992
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Title:
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PROCESS FOR MAKING A MULTILAYER LEAD FRAME ASSEMBLY FOR AN INTEGRATED CIRCUIT STRUCTURE AND MULTILAYER INTEGRATED CIRCUIT DIE PACKAGE FORMED BY SUCH PROCESS
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Assignee
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| P.O. BOX 3453 |
| 901 THOMPSON PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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JOHN P. TAYLOR
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658 NEW DORSET COURT
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SAN JOSE, CA 95136-2932
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