Patent Assignment Details
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| Reel/Frame: | 005992/0167 | |
| Pages: | 4 |
| | Recorded: | 01/21/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/1993
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Application #:
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07794149
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Filing Dt:
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11/21/1991
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Title:
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HEAT SINK/CIRCUIT BOARD ASSEMBLY
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Assignee
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| 4-1, MEGURO 1-CHOME, MEGURO-KU, TOKYO, JAPAN |
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Correspondence name and address
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FLEIT, JACOBSON, COHN, PRICE,
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HOLMAN & STERN
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THE JENIFER BLDG.
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400 SEVENTH ST., NW
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WASHINGTON, DC 20004
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