Patent Assignment Details
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Reel/Frame: | 006145/0316 | |
| Pages: | 5 |
| | Recorded: | 05/27/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/1993
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Application #:
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07889521
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Filing Dt:
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05/27/1992
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Title:
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METHOD FOR PLANARIZING SEMICONDUCTOR WAFERS WITH A NON-CIRCULAR POLISHING PAD
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Assignee
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A CORPORATION OF DE |
2805 E. COLUMBIA ROAD |
BOISE, IDAHO 83706-9608 |
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Correspondence name and address
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WELLS, ST. JOHN & ROBERTS, P.S.
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LEWIS C. LEE
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W. 601 MAIN AVENUE, STE. 815
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SPOKANE, WA 99201-0679
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