Patent Assignment Details
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| Reel/Frame: | 006226/0190 | |
| Pages: | 3 |
| | Recorded: | 08/18/1992 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/1995
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Application #:
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07931787
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Filing Dt:
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08/18/1992
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Title:
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METHOD OF FORMING BORON DOPED SILICON LAYER AND SEMICONDUCTOR MANUFACTURING METHOD
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Assignee
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| 72, HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI |
| KANAGAWA-KEN, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW,
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GARRET & DUNNER
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DAVID W. HILL
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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