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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:006412/0825   Pages: 7
Recorded: 02/26/1993
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE ON 10/02/1992
Total properties: 6
1
Patent #:
Issue Dt:
09/15/1992
Application #:
07586758
Filing Dt:
09/24/1990
Title:
SEMICONDUCTOR CHIP ASSEMBLIES AND METHODS OF MAKING SAME
2
Patent #:
Issue Dt:
09/15/1992
Application #:
07673020
Filing Dt:
03/21/1991
Title:
SEMICONDUCTOR CHIP ASSEMBLIES WITH FAN-IN LEADS
3
Patent #:
Issue Dt:
09/13/1994
Application #:
07765928
Filing Dt:
09/24/1991
Title:
SEMICONDUCTOR CHIP ASSEMBLIES WITH FACE-UP MOUNTING AND REAR-SURFACE CONNECTION TO SUBSTRATE
4
Patent #:
Issue Dt:
11/29/1994
Application #:
07815401
Filing Dt:
12/31/1991
Title:
METHOD OF MAKING A MULTI-LAYER CIRCUIT ASSEMBLY
5
Patent #:
Issue Dt:
02/01/1994
Application #:
07816634
Filing Dt:
12/31/1991
Title:
MULTI-LAYER CIRCUIT CONSTRUCTION METHODS WITH CUSTOMIZATION FEATURES
6
Patent #:
Issue Dt:
09/13/1994
Application #:
07865984
Filing Dt:
04/09/1992
Title:
SEMICONDUCTOR CHIP ASSEMBLIES AND METHODS OF MAKING SAME
Assignor
1
Exec Dt:
09/21/1992
Assignee
1
103 FAIRVIEW PARK DRIVE
ELMSFORD, NEW YORK 10523
Correspondence name and address
JOSEPH S. LITTENBERG
LERNER, DAVID, LITTENBERG,
KRUMHOLZ & MENTLIK
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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