Patent Assignment Details
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| Reel/Frame: | 006734/0088 | |
| Pages: | 3 |
| | Recorded: | 10/01/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/24/1995
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Application #:
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08130225
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Filing Dt:
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10/01/1993
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Title:
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METHOD TO FORM A LOW RESISTANT BOND PAD INTERCONNECT
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Assignee
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| 2805 E. COLUMBIA ROAD |
| MAIL STOP 507, PATENT DEPARTMENT |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON SEMICONDUCTOR, INC.
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DAVID J. PAUL
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MAIL STOP 507, PATENT DEPT.
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2805 E. COLUMBIA ROAD
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BOISE, ID 83706
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