Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 006814/0235 | |
| Pages: | 3 |
| | Recorded: | 12/13/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/1996
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Application #:
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08166747
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Filing Dt:
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12/13/1993
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Title:
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PROCESS OF MANUFACTURING AN ELECTRICAL BONDING INTERCONNECT HAVING A METAL BOND PAD PORTION AND HAVING A CONDUCTIVE EPOXY PORTION COMPRISING AN OXIDE REDUCING AGENT
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Assignee
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| PATENT DEPARTMENT, MS 507 |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON SEMICONDUCTOR, INC.
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SUSAN B. COLLIER
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PATENT DEPARTMENT, MS 507
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2805 E. COLUMBIA ROAD
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BOISE, IDAHO 83706
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