Patent Assignment Details
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Reel/Frame: | 006815/0963 | |
| Pages: | 4 |
| | Recorded: | 12/16/1993 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/04/1995
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Application #:
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08168762
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Filing Dt:
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12/16/1993
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Title:
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INTEGRATED CIRCUIT SUBSTRATE WITH COOLING ACCELERATOR SUBSTRATE
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Assignee
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6, KANDA SURUGADAI 4-CHOME |
CHIYODA-KU, TOKYO, JAPAN |
JAPAN |
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Correspondence name and address
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JOHN X. GARRED ESQ.
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FAY, SHARPE, BEALL, FAGAN ET AL
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1100 SUPERIOR AVENUE-SUITE 700
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CLEVELAND, OH 44114-2518
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