Patent Assignment Details
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Reel/Frame: | 007083/0567 | |
| Pages: | 3 |
| | Recorded: | 07/27/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/29/1997
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Application #:
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08281098
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Filing Dt:
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07/27/1994
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Title:
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SEMICONDUCTOR DEVICE IN A RESIN PACKAGE HOUSED IN A FRAME HAVING HIGH THERMAL CONDUCTIVITY
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Assignee
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1015, KAMIKODANAKA, NAKAHARA-KU, KAWASAKI-SHI |
KANAGAWA, 211, JAPAN |
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Correspondence name and address
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ARMSTRONG, WESTERMAN, HATTORI, MCLELAND
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& NAUGHTON - WILLIAM F. WESTERMAN
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1725 K ST., NW
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SUITE 1000
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WASHINGTON, DC 20006
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