Patent Assignment Details
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| Reel/Frame: | 007233/0413 | |
| Pages: | 2 |
| | Recorded: | 10/24/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/04/1997
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Application #:
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08327907
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Filing Dt:
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10/24/1994
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Title:
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PROCESS AND APPARATUS FOR SOLDERING ELECTRONIC COMPONENTS TO PRINTED CIRCUIT BOARD, AND ASSEMBLY OF ELECTRONIC COMPONENTS AND PRINTED CIRCUIT BOARD OBTAINED BY WAY OF SOLDERING
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Assignee
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| 1015, KAMIKODANAKA, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA,, JAPAN 211 |
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Correspondence name and address
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JAMES D. HALSEY, JR.
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STAAS & HALSEY
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700 ELEVENTH STREET, N.W., SUITE 500
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WASHINGTON, D.C. 20001
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