Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 007635/0186 | |
| Pages: | 4 |
| | Recorded: | 09/12/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/18/1996
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Application #:
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08267878
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Filing Dt:
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06/28/1994
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Title:
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MANUFACTURING DUAL SIDED WIRE BONDED INTEGRATED CIRCUIT CHIP PACKAGES USING OFFSET WIRE BONDS AND SUPPORT BLOCK CAVITIES
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Assignees
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 94086 |
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| 2-10-1 KOMINE, YAHATANISHI-KU |
| KITAKYSUSHU, JAPAN 806 |
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Correspondence name and address
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BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
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ATTN: LESTER J. VINCENT
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1279 OAKMEAD PARKWAY
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SUNNYVALE, CA 94086
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