Patent Assignment Details
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Reel/Frame: | 007702/0691 | |
| Pages: | 2 |
| | Recorded: | 09/29/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/27/1997
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Application #:
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08537248
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Filing Dt:
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09/29/1995
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Title:
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MULTI-CHIP CERAMIC MODULE FOR MOUNTING ELECTRIC PARTS ON BOTH SUBSTRATE AND CAP CONNECTED THROUGH INTERCONNECTING PINS
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Assignee
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7-1 SHIBA 5-CHOME |
MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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HELFGOTT & KARAS, P.C.
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SAMSON HELFGOTT
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EMPIRE STATE BUILDING, 60TH FLOOR
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NEW YORK, NY 10118
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