Patent Assignment Details
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| Reel/Frame: | 007828/0060 | |
| Pages: | 2 |
| | Recorded: | 01/16/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/10/1998
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Application #:
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08586224
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Filing Dt:
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01/16/1996
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Title:
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LEAD FRAME, ITS USE IN THE FABRICATION OF RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
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Assignee
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA, JAPAN |
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Correspondence name and address
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NIXON & VANDERHYE P.C.
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LARRY S. NIXON
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1100 NORTH GLEBE ROAD, 8TH FLOOR
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ARLINGTON, VA 22201
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