Patent Assignment Details
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| Reel/Frame: | 007847/0149 | |
| Pages: | 2 |
| | Recorded: | 12/18/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/25/1997
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Application #:
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08573859
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Filing Dt:
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12/18/1995
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Title:
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METHOD OF FABRICATING LOW LEAKAGE SOI INTEGRATED CIRCUITS
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Assignee
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| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION/ERIC W. PETRASKE
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INTELLECTUAL PROPERTY LAW DEPT.
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DEPT. 18G/BLDG. 300-482
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1580 ROUTE 52
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HOPEWELL JUNCTION, NEW YORK 12533-6531
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