Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 008240/0328 | |
| Pages: | 4 |
| | Recorded: | 11/25/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/18/1996
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Application #:
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08267878
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Filing Dt:
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06/28/1994
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Title:
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MANUFACTURING DUAL SIDED WIRE BONDED INTEGRATED CIRCUIT CHIP PACKAGES USING OFFSET WIRE BONDS AND SUPPORT BLOCK CAVITIES
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Assignees
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95052 |
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2-10-1 KOMINE YAHATANISHI-KU |
KITAKYSUSHU, JAPAN 806 |
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Correspondence name and address
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BALKELY, SOKOLOFF, TAYLOR & ZAFMAN
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LESTER J. VINCENT
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1279 OAKMEAD PARKWAY
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SUNNYVALE, CALIFORNIA 94086
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