Patent Assignment Details
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Reel/Frame: | 008488/0625 | |
| Pages: | 3 |
| | Recorded: | 04/25/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/04/1998
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Application #:
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08789332
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Filing Dt:
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01/23/1997
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Title:
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BACKING PAD AND METHOD FOR POLISHING SEMICONDUCTOR WAFER THEREWITH
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Assignee
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4-2 MARUNOUCHI 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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RONALD R. SNIDER
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P.O. BOX 27613
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WASHINGTON, D.C. 20038-7613
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