Patent Assignment Details
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| Reel/Frame: | 008877/0476 | |
| Pages: | 11 |
| | Recorded: | 12/15/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/20/1999
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Application #:
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08914673
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Filing Dt:
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08/19/1997
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Title:
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USE OF TICL4 ETCHBACK PROCESS DURING INTEGRATED CVD-TI/TIN WAFER PROCESSING
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Assignees
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| SHINAGAWA-KU, 141 |
| 6-7-35 KITASHINAGAWA |
| TOKYO, JAPAN |
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| SHINAGAWA-KU, 141 |
| 2120 W. GUADALUPE ROAD |
| GILBERT, ARIZONA 85233 |
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Correspondence name and address
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WOOD, HERRON & EVANS, L.L.P.
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STEPHEN W. BARNS, ESQUIRE
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2700 CAREW TOWER
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441 VINE STREET
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CINCINNATI, OH 45202
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