Patent Assignment Details
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| Reel/Frame: | 010229/0569 | |
| Pages: | 5 |
| | Recorded: | 03/16/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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09268785
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Filing Dt:
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03/16/1999
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Title:
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METHOD FOR FORMING SOLDER BUMPS ON FLIP CHIPS AND DEVICES FORMED
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Assignee
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| 195 SEC. 4 CHUNG HSING ROAD |
| CHUTUNG, HSINCHU, 310, TAIWAN R.O.C |
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Correspondence name and address
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TUNG & ASSOCIATES
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RANDY W. TUNG
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838 W. LONG LAKE ROAD
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SUITE 120
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BLOOMFIELD HILLS, MICHIGAN 48302
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