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Patent Assignment Details
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Reel/Frame:010432/0626   Pages: 3
Recorded: 12/01/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/03/2001
Application #:
09452642
Filing Dt:
12/01/1999
Title:
THERMALLY DEPOSITED PORTION STRUCTURE OF THERMOPLASTIC RESIN MOLDED PRODUCT
Assignors
1
Exec Dt:
11/10/1999
2
Exec Dt:
11/12/1999
Assignee
1
11-1 HORAI-CHO 1-CHOME,
FUKUSHIMA-SHI, FUKUSHIMA-KEN, JAPAN
Correspondence name and address
MCGLEW AND TUTTLE, P.C.
JOHN JAMES MCGLEW
SCARBOROUGH STATION
SCARBOROUGH, NY 10510-0827

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