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Patent Assignment Details
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Reel/Frame:010674/0559   Pages: 3
Recorded: 03/10/2000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/15/2003
Application #:
09508467
Filing Dt:
03/10/2000
Title:
SILICON SEMICONDUCTOR WAFER AND METHOD FOR PRODUCING THE SAME
Assignors
1
Exec Dt:
02/16/2000
2
Exec Dt:
02/17/2000
3
Exec Dt:
02/16/2000
4
Exec Dt:
02/16/2000
5
Exec Dt:
02/16/2000
6
Exec Dt:
02/18/2000
7
Exec Dt:
02/18/2000
Assignees
1
6-3, OTEMACHI 2-CHOME, CHIYODA-KU
TOKYO 100-8071, JAPAN
2
11-12, HATCHOBORI 3-CHOME, CHUO-KU
TOKYO 104-0032, JAPAN
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: MICHAEL R. DAVIS, ESQ.
2033 K STREET NW, SUITE 800
WASHINGTON, DC 20006

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