Patent Assignment Details
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| Reel/Frame: | 010901/0674 | |
| Pages: | 3 |
| | Recorded: | 06/15/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/11/2000
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Application #:
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09136424
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Filing Dt:
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08/20/1998
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Title:
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FLIP CHIP MOUNTING SUBSTRATE WITH RESIN FILLED BETWEEN SUBSTRATE AND SEMICONDUCTOR CHIP
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Assignee
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| OAZA KURITA, NAGANO-SHI |
| 711, AZA SHARIDEN |
| NAGANO 380-0921, JAPAN |
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Correspondence name and address
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STAAS & HALSEY LLP
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DAVID M. PITCHER
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700 ELEVENTH STREET, N.W., SUITE 500
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WASHINGTON, D.C. 20001
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