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Patent Assignment Details
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Reel/Frame:011375/0410   Pages: 4
Recorded: 12/14/2000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/18/2005
Application #:
09735548
Filing Dt:
12/14/2000
Publication #:
Pub Dt:
08/30/2001
Title:
METHOD OF BONDING METAL PLATES, APPARATUS THEREFOR AND HOT STRIP MILL
Assignors
1
Exec Dt:
10/26/2000
2
Exec Dt:
11/06/2000
3
Exec Dt:
10/26/2000
4
Exec Dt:
10/26/2000
5
Exec Dt:
10/26/2000
6
Exec Dt:
10/31/2000
7
Exec Dt:
11/01/2000
8
Exec Dt:
11/01/2000
9
Exec Dt:
10/26/2000
10
Exec Dt:
11/01/2000
11
Exec Dt:
11/01/2000
12
Exec Dt:
11/01/2000
13
Exec Dt:
10/27/2000
14
Exec Dt:
10/27/2000
15
Exec Dt:
10/27/2000
Assignees
1
2477, TAKABA, HITACHINAKA-SHI
IBARAKI-KEN, JAPAN
2
1, GOEDONG-DONG
POHANG-SI, KOREA, REPUBLIC OF
3
32, HYOJA-DONG, NAM-KU
POHANG CITY KYUNGBUK, KOREA, REPUBLIC OF
Correspondence name and address
EVENSON, MCKEOWN, EDWARDS & LENAHAN PLLC
DONALD D. EVENSON, ESQ.
1200 G STREET, N.W.
SUITE 700
WASHINGTON, DC 20005-3814

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