Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 011400/0420 | |
| Pages: | 5 |
| | Recorded: | 12/18/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/30/1998
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Application #:
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08582643
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Filing Dt:
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01/04/1996
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Title:
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IC PACKAGING LEAD FRAME FOR REDUCING CHIP STRESS AND DEFORMATION
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Patent #:
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Issue Dt:
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12/22/1998
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Application #:
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08678390
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Filing Dt:
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07/02/1996
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Title:
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STAINING TECHNIQUE FOR SEMICONDUCTOR DEVICE FOR SEM EXPOSURE
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Patent #:
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Issue Dt:
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12/29/1998
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Application #:
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08729916
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Filing Dt:
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10/15/1996
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Title:
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LOW-VOLTAGE MULTIPATH-MILLER-ZERO-COMPENSATED CMOS CLASS-AB OPERATIONAL AMPLIFIER
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Assignee
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| SINGAPORE SCIENCE PARK II |
| 11 SCIENCE PARK ROAD |
| SINGAPORE, SINGAPORE 11768 |
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Correspondence name and address
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PROSKAUER ROSE LLP
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GREGG I. GOLDMAN
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1585 BROADWAY
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NEW YORK, NY 10036-8299
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