Patent Assignment Details
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| Reel/Frame: | 011665/0155 | |
| Pages: | 6 |
| | Recorded: | 03/30/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09823844
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Filing Dt:
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03/30/2001
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Publication #:
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Pub Dt:
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10/03/2002
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Title:
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Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices
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Assignee
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| CHUTUNG |
| NO. 195, SEC, 4, CHUNG-HSING ROAD |
| HSINCHU, TAIWAN |
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Correspondence name and address
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JASON Z. LIN
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19597 VIA MONTE DRIVE
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SARATOGA, CA 95070
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