Patent Assignment Details
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| Reel/Frame: | 011762/0229 | |
| Pages: | 3 |
| | Recorded: | 04/05/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09806828
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Filing Dt:
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04/05/2001
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Title:
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NON-PERFLUORO FLUORINE-CONTAINING RESIN MOLDED ARTICLE HAVING
LOW-TEMPERATURE HEAT-SEALING PROPERTY
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Assignee
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| UMEDA CENTER BUILDING, 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA 530-8323, JAPAN |
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Correspondence name and address
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SUGHRUE, MION, ZINN, MACPEAK, ET AL
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ABRAHAM J. ROSNER
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, D.C. 20037-3213
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