Patent Assignment Details
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Reel/Frame: | 011870/0809 | |
| Pages: | 2 |
| | Recorded: | 06/07/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09003516
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Filing Dt:
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01/06/1998
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Title:
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A LEAD BONDING MACHINE FOR BONDING LEADS OF A CHIP DISPOSED OVER A CARRIER TAPE TO AN ELECTRODE PAD FORMED ON THE CHIP
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Assignees
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CHIYODA-KU |
6, KANDA SURUGADAI 4-CHOME |
TOKYO, JAPAN |
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CHIYODA-KU |
OME-SHI |
TOKYO, JAPAN |
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Correspondence name and address
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MATTINGLY, STANGER & MALUR, P.C.
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JOHN R. MATTINGLY
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104 EAST HUME AVENUE
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ALEXANDRIA, VA 22301
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