Patent Assignment Details
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| Reel/Frame: | 011939/0177 | |
| Pages: | 4 |
| | Recorded: | 06/29/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09384725
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Filing Dt:
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08/27/1999
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Title:
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METHOD FOR RECLAIMING WAFER SUBSTRATE AND POLISHING SOLUTION COMPOSITIONS THEREFOR
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Assignees
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| 3-18, WAKINOHAMA-CHO 1-CHOME, CHUO-KU |
| KOBE-SHI, HYOGO 651-0072, JAPAN |
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| 31031 HUNTWOOD AV. |
| HAYWARD, CALIFORNIA 94544 |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND ET AL
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CORWIN P. UMBACH
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1755 JEFFERSON DAVIS HIGHWAY
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ATTORNEYS AT LAW, FOURTH FLOOR
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ARLINGTON, VA 22202
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