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Patent Assignment Details
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Reel/Frame:012020/0545   Pages: 4
Recorded: 07/24/2001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/25/2003
Application #:
09911675
Filing Dt:
07/24/2001
Publication #:
Pub Dt:
01/30/2003
Title:
SEMICONDUCTOR WAFER HOLDING ASSEMBLY
Assignors
1
Exec Dt:
07/23/2001
2
Exec Dt:
07/23/2001
Assignee
1
3-6 AKASAKA 5-CHOME
TBS BROADCAST CENTER
MINATO-KU, TOKYO 107, JAPAN
Correspondence name and address
WOOD, HERRON & EVANS, L.L.P.
DONALD F. FREI
2700 CAREW TOWER
441 VINE STREET
CINCINNATI, OH 45202

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