Patent Assignment Details
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| Reel/Frame: | 012095/0424 | |
| Pages: | 4 |
| | Recorded: | 08/22/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/11/2003
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Application #:
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09844505
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Filing Dt:
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04/27/2001
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Publication #:
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Pub Dt:
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02/21/2002
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Title:
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POLYMERIC COMPOSITION FOR PACKAGING A SEMICONDUCTOR ELECTRONIC DEVICE AND PACKAGING OBTAINED THEREFROM
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Assignees
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| VIA C. OLIVETTI, 2 |
| 20041 AGRATE BRIANZA, ITALY |
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| 14-25, RYOKE 5-CHOME |
| KAWAGUCHI 332, JAPAN |
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Correspondence name and address
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ALLEN, DYER, DOPPELT, MILBRATH, ET AL.
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CHRISTOPHER F. REGAN, ESQ.
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255 S. ORANGE AVE.
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P.O. BOX 3791
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ORLANDO, FLORIDA 32802
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