Patent Assignment Details
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| Reel/Frame: | 013257/0906 | |
| Pages: | 3 |
| | Recorded: | 09/04/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10233465
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Filing Dt:
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09/04/2002
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Publication #:
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Pub Dt:
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07/03/2003
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Title:
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Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module
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Assignee
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| 1-1 SHIBAURA 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL.
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ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, DC 20005-3315
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