Total properties:
39
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Patent #:
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Issue Dt:
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08/14/2001
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Application #:
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09006972
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Filing Dt:
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01/14/1998
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Title:
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PRE-QUANTIZATION IN MOTION COMPENSATED VIDEO CODING
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09080013
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Filing Dt:
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05/15/1998
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Title:
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SYSTEM AND METHOD FOR ADAPTIVE MULTI-RATE (AMR) VOCODER RATE ADAPTION
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09163675
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Filing Dt:
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09/30/1998
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Title:
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CMOS ELECTROSTATIC DISCHARGEPROTECTION CIRCUIT WITH MINIMAL LOADING FOR HIGH SPEED CIRCUIT APPLICATIONS
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Patent #:
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Issue Dt:
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04/23/2002
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Application #:
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09239617
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Filing Dt:
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01/29/1999
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Title:
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MULTIPLE CHIP MODULE WITH INTEGRATED RF CAPABILITIES
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09252851
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Filing Dt:
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02/17/1999
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Title:
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LEADLESS CHIP CARRIER DESIGN AND STRUCTURE
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09493591
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Filing Dt:
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01/31/2000
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Title:
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Method and structure for temperature stabilization in flip chip technology
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Patent #:
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Issue Dt:
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12/31/2002
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Application #:
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09599210
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Filing Dt:
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06/22/2000
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Title:
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STRUCTURE AND METHOD FOR SECURING A MOLDING COMPOUND TO A LEADFRAME PADDLE
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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09638172
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Filing Dt:
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08/11/2000
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Title:
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METHOD AND STRUCTURE FOR SECURING A MOLD COMPOUND TO A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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09644035
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Filing Dt:
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08/22/2000
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Title:
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MOLDED SHIELD STRUCTURES AND METHOD FOR THEIR FABRICATION
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Patent #:
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Issue Dt:
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08/26/2003
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Application #:
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09648879
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Filing Dt:
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08/25/2000
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Title:
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EXPOSED PADDLE LEADFRAME FOR SEMICONDUCTOR DIE PACKING
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Patent #:
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Issue Dt:
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07/01/2003
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Application #:
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09661490
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Filing Dt:
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09/14/2000
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Title:
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METHOD AND STRUCTURE FOR TEMPERTURE STABILIZATION IN SEMICONDUCTOR DEVICES
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Patent #:
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Issue Dt:
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07/26/2005
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Application #:
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09713834
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Filing Dt:
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11/15/2000
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Title:
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LEADLESS CHIP CARRIER DESIGN AND STRUCTURE
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Patent #:
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Issue Dt:
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10/01/2002
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Application #:
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09779402
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Filing Dt:
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02/08/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Title:
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ON-CHIP TRANSFORMERS
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Patent #:
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Issue Dt:
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08/19/2003
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Application #:
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09797307
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Filing Dt:
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03/01/2001
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Title:
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TRANSFORMER COMPRISING STACKED INDUCTORS
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Patent #:
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Issue Dt:
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03/19/2002
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Application #:
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09799446
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Filing Dt:
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03/05/2001
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Title:
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TEMPERATURE STABILIZATION IN FLIP CHIP TECHNOLOGY
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Patent #:
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Issue Dt:
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04/13/2004
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Application #:
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09828535
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Filing Dt:
|
04/06/2001
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Title:
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METHOD AND APPARATUS FOR MOTION COMPENSATED VIDEO CODING
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|
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Patent #:
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|
Issue Dt:
|
10/19/2004
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Application #:
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09842601
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Filing Dt:
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04/26/2001
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Title:
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SYSTEM FOR ASSOCIATING USER SELECTABLE INFORMATION IN WIRELESS DEVICES
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Patent #:
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Issue Dt:
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08/26/2003
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Application #:
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09877912
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Filing Dt:
|
06/08/2001
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Title:
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LEADLESS FLIP CHIP CARRIER DESIGN AND STRUCTURE
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|
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Patent #:
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|
Issue Dt:
|
11/01/2005
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Application #:
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09878815
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Filing Dt:
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06/11/2001
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Title:
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STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS CHIP CARRIER
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|
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Patent #:
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Issue Dt:
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03/15/2005
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Application #:
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09894728
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Filing Dt:
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06/28/2001
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Publication #:
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Pub Dt:
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10/17/2002
| | | | |
Title:
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STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS MULTI-DIE CARRIER
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Patent #:
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|
Issue Dt:
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06/24/2003
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Application #:
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09916666
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Filing Dt:
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07/26/2001
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Publication #:
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Pub Dt:
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11/14/2002
| | | | |
Title:
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STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS CHIP CARRIER WITH EMBEDDED ANTENNA
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Patent #:
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|
Issue Dt:
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03/23/2004
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Application #:
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09930747
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Filing Dt:
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08/14/2001
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Publication #:
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Pub Dt:
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11/21/2002
| | | | |
Title:
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STRUCTURE AND METHOD FOR FABRICATION OF A LEADLESS CHIP CARRIER WITH EMBEDDED INDUCTOR
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Patent #:
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|
Issue Dt:
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01/06/2004
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Application #:
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09971162
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Filing Dt:
|
10/05/2001
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Title:
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VOLTAGE REGULATION FOR SEMICONDUCTOR DIES AND RELATED STRUCTURE
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Patent #:
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|
Issue Dt:
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01/28/2003
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Application #:
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09972706
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Filing Dt:
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10/05/2001
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Title:
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HIGH INDUCTANCE INDUCTOR IN A SEMICONDUCTOR PACKAGE
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|
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Patent #:
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|
Issue Dt:
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06/10/2003
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Application #:
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10012792
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Filing Dt:
|
11/13/2001
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Title:
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CONTROLLED IMPEDANCE LEADS IN A LEADFRAME FOR HIGH FREQUENCY APPLICATIONS
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|
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Patent #:
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|
Issue Dt:
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01/06/2004
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Application #:
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10012812
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Filing Dt:
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11/13/2001
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Publication #:
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Pub Dt:
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10/16/2003
| | | | |
Title:
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CONTROLLED IMPEDANCE TRANSMISSION LINES IN A REDISTRIBUTION LAYER
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Patent #:
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|
Issue Dt:
|
06/15/2004
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Application #:
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10013023
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Filing Dt:
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11/05/2001
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Title:
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FLIP-CHIP LEADFRAME PACKAGE
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|
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Patent #:
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|
Issue Dt:
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09/07/2004
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Application #:
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10013130
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Filing Dt:
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12/07/2001
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Title:
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LEADLESS CHIP CARRIER FOR REDUCED THERMAL RESISTANCE
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|
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Patent #:
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|
Issue Dt:
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10/12/2004
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Application #:
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10016309
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Filing Dt:
|
11/02/2001
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Title:
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OFF-CHIP INDUCTOR
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|
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Patent #:
|
|
Issue Dt:
|
08/03/2004
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Application #:
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10020105
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Filing Dt:
|
12/15/2001
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Title:
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SHIELDED ANTENNA IN A SEMICONDUCTOR PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
04/26/2005
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Application #:
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10020380
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Filing Dt:
|
10/30/2001
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Title:
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MULTIPLE CHIP MODULE WITH INTEGRATED RF CAPABILITIES
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|
|
Patent #:
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|
Issue Dt:
|
08/24/2004
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Application #:
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10025438
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Filing Dt:
|
12/19/2001
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Title:
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METHOD FOR INTEGRATING PASSIVES ON-DIE UTILIZING UNDER BUMP METAL AND RELATED STRUCTURE
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|
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Patent #:
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|
Issue Dt:
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11/16/2004
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Application #:
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10026134
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Filing Dt:
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12/22/2001
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Title:
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LAMINATE PACKAGE EMBEDDED ANTENNA
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Patent #:
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|
Issue Dt:
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03/11/2003
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Application #:
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10034880
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Filing Dt:
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12/27/2001
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Title:
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STRUCTURE FOR A HETEROJUNCTION BIPOLAR TRANSISTOR
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Patent #:
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|
Issue Dt:
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06/01/2004
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Application #:
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10057098
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Filing Dt:
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01/23/2002
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Title:
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HIGH PERFORMANCE BIFET LOW NOISE AMPLIFIER
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Patent #:
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Issue Dt:
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07/27/2004
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Application #:
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10115317
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Filing Dt:
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04/03/2002
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Title:
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STRUCTURE AND METHOD IN AN HBT FOR AN EMITTER BALLAST RESISTOR WITH IMPROVED CHARACTERISTICS
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Patent #:
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|
Issue Dt:
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01/16/2007
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Application #:
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10124464
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Filing Dt:
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04/16/2002
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Publication #:
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Pub Dt:
|
01/02/2003
| | | | |
Title:
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RATE ADAPTATION FOR USE IN ADAPTIVE MULTI-RATE VOCODER
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|
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Patent #:
|
|
Issue Dt:
|
09/02/2003
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Application #:
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10163662
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Filing Dt:
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06/04/2002
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Title:
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METHOD FOR METALLIZATION OF A SEMICONDUCTOR SUBSTRATE AND RELATED STRUCTURE
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Patent #:
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Issue Dt:
|
01/06/2004
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Application #:
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10190011
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Filing Dt:
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07/05/2002
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Title:
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METHOD FOR FABRICATION OF A HETEROJUNCTION BIPOLAR TRANSISTOR
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