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Reel/Frame:013628/0965   Pages: 3
Recorded: 12/27/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/28/2004
Application #:
10331070
Filing Dt:
12/27/2002
Publication #:
Pub Dt:
07/03/2003
Title:
METHOD OF POLISHING COPPER LAYER OF SUBSTRATE
Assignors
1
Exec Dt:
12/16/2002
2
Exec Dt:
12/16/2002
3
Exec Dt:
12/16/2002
4
Exec Dt:
12/16/2002
5
Exec Dt:
12/16/2002
6
Exec Dt:
12/16/2002
7
Exec Dt:
12/16/2002
Assignees
1
1650 KIYONO, MATSUSHIRO-MACHI
NAGANO-SHI, NAGANO, JAPAN 381-1233
2
1-1 CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO
NISHIKASUGAI-GUN, AICHI, JAPAN 452-8502
Correspondence name and address
JORDAN AND HAMBURG LLP
C. BRUCE HAMBURG, ESQ.
122 EAST 42ND STREET
CHANIN BUILDING,SUITE 4000
NEW YORK, NY 10168

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