Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013636/0138 | |
| Pages: | 5 |
| | Recorded: | 05/01/2003 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE, FILED 12/18/02 RECORDED ON REEL 013594 FRAME 0054 ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10321650
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Filing Dt:
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12/18/2002
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Publication #:
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Pub Dt:
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09/25/2003
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Title:
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Method for manufacturing a semiconductor device and a resin sealing device therefor
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Assignees
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| 6-2, OOTEMACHI 2-CHOME CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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JEFFREY A. WYAND
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700 THIRTEENTH ST., N.W.
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STE. 300
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WASHINGTON, DC 20005-3960
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