Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 013650/0020 | |
| Pages: | 10 |
| | Recorded: | 05/13/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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11/26/2002
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Application #:
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09588357
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Filing Dt:
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06/07/2000
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Title:
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CIRCUIT DEVICE WITH BONDING STRENGTH IMPROVED AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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12/17/2002
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Application #:
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09653361
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Filing Dt:
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08/31/2000
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Title:
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SEMICONDUCTOR DEVICE WITH P-N JUNCTION DIODE AND METHOD OF FORMING THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09822237
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Filing Dt:
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04/02/2001
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Publication #:
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Pub Dt:
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11/06/2003
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Title:
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Semiconductor device and method for manufacturing the same
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Patent #:
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Issue Dt:
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01/06/2004
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Application #:
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09924472
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Filing Dt:
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08/09/2001
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Publication #:
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Pub Dt:
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01/10/2002
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A T-SHAPED FLOATING GATE
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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10090626
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Filing Dt:
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03/06/2002
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Publication #:
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Pub Dt:
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09/12/2002
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10147903
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Filing Dt:
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05/20/2002
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Publication #:
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Pub Dt:
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11/21/2002
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Title:
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Flip-chip-type semiconductor device and manufacturing method thereof
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10170650
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Title:
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Method of manufacturing semiconductor device
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10212234
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Filing Dt:
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08/06/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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Method for forming a capping layer on a copper interconnect
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Assignee
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| 1753 SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI |
| KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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YOUNG & THOMPSON
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ROLAND E. LONG, JR.
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745 SOUTH 23RD STREET
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SECOND FLOOR
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ARLINGTON, VA 22202
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