Patent Assignment Details
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| Reel/Frame: | 014148/0128 | |
| Pages: | 4 |
| | Recorded: | 06/04/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10453605
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Filing Dt:
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06/04/2003
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Publication #:
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Pub Dt:
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06/24/2004
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Title:
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DIE BONDING APPARATUS
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Assignees
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| 4-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6335 |
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| 6-2, OOTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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JEFFREY A. WYAND
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700 THIRTEENTH STREET, N.W., SUITE 300
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WASHINGTON, D.C. 20005-3960
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