Patent Assignment Details
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| Reel/Frame: | 014391/0159 | |
| Pages: | 3 |
| | Recorded: | 08/18/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/14/2006
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Application #:
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10627894
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Filing Dt:
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07/24/2003
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Publication #:
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Pub Dt:
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02/12/2004
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Title:
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FLUORINE-FREE PLASMA CURING PROCESS FOR POROUS LOW-K MATERIALS
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Assignee
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| 2-11-24, TSUKIJI, CHUO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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KILLWORTH, GOTTMAN, HAGAN & SCHAEFF, LLP
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BRIAN L. SMILER
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ONE SOUTH MAIN STREET, SUITE 500
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ONE DAYTON CENTRE
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DAYTON, OH 45402
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