Patent Assignment Details
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Reel/Frame: | 014451/0888 | |
| Pages: | 2 |
| | Recorded: | 05/15/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10416839
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Filing Dt:
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05/15/2003
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Title:
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TOOL FOR THERMO-COMPRESSION-BONDING CHIPS, AND CHIP PACKAGING DEVICE HAVING THE SAME
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Assignee
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3-3, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI |
NAKANOSHIMA MITSUI BUILDING |
OSAKA, JAPAN 530-8222 |
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Correspondence name and address
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RADER, FISHMAN & GRAUER PLLC
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DAVID T. NIKAIDO
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1233 20TH STREET, N.W.
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STE. 501
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WASHINGTON, DC 20036
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05/10/2024 05:48 PM
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