Patent Assignment Details
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| Reel/Frame: | 014784/0495 | |
| Pages: | 3 |
| | Recorded: | 06/28/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10797706
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Filing Dt:
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03/10/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Title:
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RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE THEREWITH
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Assignee
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
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Correspondence name and address
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ROBERT G. WEILACHER, ESQ.
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1230 PEACHTREE STREET, N.E.
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SUITE 3100, PROMENADE II
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ATLANTA, GA 30309-3592
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