Patent Assignment Details
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| Reel/Frame: | 014900/0662 | |
| Pages: | 2 |
| | Recorded: | 01/16/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10758392
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Filing Dt:
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01/16/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD FOR IMPROVING ADHESIVITY OF COPPER METAL LAYER TO BARRIER LAYER
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Assignee
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| 1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI |
| KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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YOUNG & THOMPSON
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YOLANDA REYNOLDS
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745 SOUTH 23RD STREET
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ARLINGTON, VA 22202
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