Patent Assignment Details
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| Reel/Frame: | 014904/0059 | |
| Pages: | 4 |
| | Recorded: | 01/15/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10758371
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Filing Dt:
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01/15/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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Multi-layer circuit board and method for manufacturing same
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Assignees
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO 105-8716, JAPAN |
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| 9-11, KITASHINAGAWA 5-CHOME, SHINAGAWA-KU |
| TOKYO 141-8686, JAPAN |
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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Correspondence name and address
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SMITH, GAMBRELL & RUSSELL, LLP
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ROBERT G. WEILACHER, ESQ.
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1230 PEACHTREE STREET, N.E.
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SUITE 3100, PROMENADE II
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ATLANTA, GA 30309-3592
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