Patent Assignment Details
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| Reel/Frame: | 015010/0567 | |
| Pages: | 4 |
| | Recorded: | 02/19/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/20/2007
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Application #:
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10780723
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Filing Dt:
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02/19/2004
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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SEMICONDUCTOR DEVICE HAVING A LEAD FRAME SMALLER THAN A SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR
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Assignee
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| 10-1, NAKAZAWA-CHO, HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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STEVEN I. WEISBURD
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1177 AVENUE OF THE AMERICAS
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41ST FLOOR
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NEW YORK, NY 10036-2714
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